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Tantalum Sputtering Target

tantalum sputtering target Details tantalum sputtering target Grade: R05255 Standard: ASTM B708 Material: tantalum alloy, 90% tantalum 10% tungsten Melting methods:electron-beam furnace melting Features:With higher strength than pure tantalum Delivery status: Ground finished products Application it is mainly used in the...

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Introduction to Tantalum Sputtering Target

Tantalum sputtering targets are crucial components in thin film deposition processes, widely utilized in semiconductor, solar cell, and optical coating industries. Renowned for their exceptional material properties, the products play a pivotal role in ensuring the quality and efficiency of thin film deposition applications.

Product Details:

Tantalum sputtering targets are expertly crafted from exceptionally pure tantalum metal, with a keen focus on adhering to rigorous industry benchmarks. These specialized targets come in a diverse range of sizes and compositions, meticulously customized to fulfill precise application needs across various sectors. By finely tuning grain size and microstructural characteristics, the products deliver unparalleled excellence and dependability in the realm of thin film deposition procedures.

Product Standards:

Tantalum sputtering targets adhere to industry-leading quality standards, ensuring consistent performance and reliability. The table below outlines basic parameter standards for the products:

ParameterStandard
Purity≥ 99.95%
Density16.6 g/cm³
Grain Size< 100 μm
DimensionsCustomizable
CompositionTantalum (Ta)
Surface FinishRa ≤ 0.8 μm
Thermal Conductivity57 W/m·K

Product Attributes:

  • High Purity: The products boast purity levels exceeding 99.95%, ensuring minimal impurities for superior thin film quality.

  • Customizability: Tailored to meet specific application requirements, The products are available in various dimensions and compositions.

  • Excellent Thermal Conductivity: With a thermal conductivity of 57 W/m·K, the products offer efficient heat dissipation during deposition processes.

  • Superior Surface Finish: The products feature a smooth surface finish with Ra ≤ 0.8 μm, facilitating uniform thin film deposition.

Product Functions:

The products serve as the primary source material for thin film deposition via physical vapor deposition (PVD) techniques. During sputtering processes, high-energy ions bombard the tantalum target, causing tantalum atoms to dislodge and deposit onto substrate surfaces, forming thin films with exceptional adhesion and uniformity.

Features:

  • High Purity Tantalum Metal

  • Customizable Dimensions

  • Exceptional Thermal Conductivity

  • Superior Surface Finish

  • Reliable Performance

Advantages and Highlights:

  • Empowers Top notch Meager Film Affidavit

  • Steady Execution and Unwavering quality

  • Works with Accuracy Material Testimony

  • Improves Efficiency and Yield

Application Areas:

  • Semiconductor Manufacturing

  • Solar Cell Fabrication

  • Optical Coating Industries

OEM Service:

We offer OEM services, providing customizable the products to meet specific customer requirements. Our experienced team ensures seamless integration of OEM products into diverse thin film deposition systems.

FAQ:

What is the virtue of your products?

Our products gloat immaculateness levels surpassing 99.95%.


Could you at any point redo the components of the objectives?

Indeed, we offer adaptable aspects to suit different application necessities.


What is the run of the mill grain size of your products?

Our tantalum faltering targets include a grain size of under 100 μm.

Contact Us:

For inquiries or orders, please contact: Email: betty@hx-raremetals.com

Professional Content for Professional Buyers and Global Dealers:

Our products are carefully created to satisfy the needs of expert purchasers and worldwide sellers in the semiconductor, sun powered cell, and optical covering ventures. With a guarantee to quality and dependability, we endeavor to surpass the assumptions for our regarded customers.

Our Production Capabilities:

We own a complete tungsten & molybdenum production line, tantalum & niobium production line, micron nitinol wire & tungsten wire production line, and micron nitinol tube, titanium tube, tantalum tube production line. This ensures that we have full control over the quality and specifications of our products, guaranteeing unmatched performance and reliability for our customers.

Details of tantalum sputtering target

Grade:  R05255

Standard: ASTM B708

Material: tantalum alloy, 90% tantalum 10% tungsten

Melting methods:electron-beam furnace melting

Features:With higher strength than pure tantalum

Delivery status: Ground finished products

Application

mainly used in semiconductor and optical fields.

Packing

wooden box packaging with accessories such as material certificate and packing list. The weight of single box does not exceed 100kg.


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